Polishing and abrasive materials
Abrasives. Oils. Additives. Lapping oils. Water-based additives. Corrosion protection.
Bierther Submikron Polishing and Abrasive Materials – Precision in every grain
Our Polishing and abrasive materials ensure precise Material removal, perfectly controlled Surfaces and a consistently high Processing quality. Through matched grain sizes and powerful binders, they enable efficient processes from coarse grinding to fine high-gloss polishing – ideal for demanding industrial applications. The perfectly matched combination of polishing and abrasive agents, along with the appropriate processing tools, is crucial for reproducible results.
Our Polishing and abrasive materials
- Controlled material removal and uniform surface quality
- Support for efficient processing from pre-grinding to high-gloss polishing
- Improving precision and repeatability across various manufacturing stages
- Stable performance through matched grits and high-quality bonds
Your advantage Abrasives and polishing agents offer efficient and precise processing for uniformly high-quality surfaces in every process step.
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Abrasive
Silicon carbide powder / paste
- for lapping various materials
- Green or dark/grey
- Available grain size: see FEPA table
- Concentration Paste: standard, medium, high, extra high
BSM Premium Diamond Powder / PC
- monocrystalline or polycrystalline
- Use as a lapping and polishing agent / preferably use as a polishing agent, reduces polishing time
- High removal rates with low scratching tendency
- available particle size: 0.018-66 µm / 0.25-30 µm
- Pack sizes: 20 ct. and 100 ct.
BSM Premium Diamond / PC
- Water-based, oil-based or emulsion diamond fluid
- Monocrystalline (precision grading) / polycrystalline
- Use as a lapping and polishing agent / preferably as a polishing agent, reduces polishing time
- High removal rates with low scratching tendency
- available particle size: 0.018-66 µm / 0.25-30 µm
- Pack size: 1 litre, 5 litres
- PC Concentration: standard, medium, high, extra high
Aluminium oxide powder / Aluminium oxide paste
- Suitable for lapping and polishing
- Sharp-edged, cubic
- Available grain size: see FEPA table
- Concentration Paste: standard, medium, high, extra high
Boron carbide powder / Boron carbide paste
- for lapping hard materials
- Available grain size: see FEPA table
Cerium(IV) oxide powder
- for polishing glass and crystals
- Available grain size: see table
- Pack sizes: 5 kg, 25 kg
Läppöle & Additive
A bit silly
Water-based additives
Corrosion protection
In combination with our lapping discs, the abrasives enable precise material removal. For optimal polishing results, we recommend using suitable polishing cloths.
Interested?... Your project deserves the best solution.
To fully understand your requirements and create an accurate, tailored quote, we need some technical details.
just use our Data capture form – optionally completable online or as Download PDF and return them to us by email at bierther[at]submikron.com.